Compatible sizes: 3 to 12 inches
3 inch BDD

12 inch BDD

● Particle size: Approx. 2 μm
*Please consult us for 1 μm requirements.
● Film thickness: Approx. 2 μm

● B (Boron) doping concentration
1E20 cm-3 or higher
ExtenD Opens New Umeda Satellite Office at Osaka Innovation Hub (OIH)
ExtenD to Exhibit at “Global Startup EXPO 2026” upon Recommendation by NEDO
Selected for FY2026 Promotion Strategy Enhancement Support Program “PROMOTE” by Saga Industrial Promotion Foundation
ExtenD Co., Ltd. Selected for the 2025 “Habataku Small and Medium Enterprises / Small Enterprise 300” Program
Selected for “NEDO Summit 2026 Advanced Tech Showcase”
A Stronger-Than-Expected Response at Our First Exhibition! Liquid AI Sommelier® Receives Strong Interest from Food Industry Professionals at FOOMA JAPAN 2026
Media Coverage: ExtenD Featured in the Chemical & Materials Startup Webinar
[Exhibition Announcement] FOOMA JAPAN 2026
Announcement of the nano tech Award at Nano Tech 2026
[Exhibition Announcement] ExtenD to Exhibit at nano tech 2026 Recommended by NEDO
Announcement of Exhibition at CES 2026
ExtenD Named to “ILS TOP100 STARTUPS” for the Third Consecutive Year
3 inch BDD

12 inch BDD

● Particle size: Approx. 2 μm
*Please consult us for 1 μm requirements.
● Film thickness: Approx. 2 μm

● B (Boron) doping concentration
1E20 cm-3 or higher
| Size | Minimum Unit | Shipping Format |
|---|---|---|
| 3 inch | 1 unit | Tape-mounted, inserted between plastic corrugated boards |
| 12 inch | 1 unit | Tape-mounted, packed in a wafer shipper |
| 6.4 x 6.4 mm | 20 chips | Case packaging |
*Custom orders other than the above are also available. Please feel free to contact us.
7 x 8 mm Case Packaging
6.4 x 6.4 mm

Tape-mounted, plastic corrugated board packaging
6.4 x 6.4 mm 3 inch BDD on Si
