Compatible sizes: 3 to 12 inches
3 inch BDD

12 inch BDD

● Particle size: Approx. 2 μm
*Please consult us for 1 μm requirements.
● Film thickness: Approx. 2 μm

● B (Boron) doping concentration
1E20 cm-3 or higher
Announcement of the nano tech Award at Nano Tech 2026
[Exhibition Announcement] ExtenD to Exhibit at nano tech 2026 Recommended by NEDO
Announcement of Exhibition at CES 2026
ExtenD Named to “ILS TOP100 STARTUPS” for the Third Consecutive Year
ExtenD and Diamond Quanta Partner to Bring Engineered Diamond Optics to Next-Generation Devices
ExtenD Exhibits at the Japan Patent Attorneys Association (JPAA) Technology Experience Session at the Osaka-Kansai Expo
Grasshoppe HFCVD-300 Now Featured on Metoree, Japan’s Search Platform for Researchers & Engineers
Subject: Announcement of Speaking Engagement: CEO Mitsuru Kitaichi to Speak at “NEP Pitch -2024 Final Stage-“
ExtenD Co., Ltd. Completes Seed Funding Round
Event Announcement: CTO Shinya Omagari to Discuss the Future of Applied Physics with Nobel Laureate Dr. Hiroshi Amano
Opening the Future! Our CEO Mitsuru Kitaichi to Speak at “NEDO × Deep Tech Startup” Session
Announcement of Participation in the Osaka-Kansai Expo “Business / Technology Idea Contest”
3 inch BDD

12 inch BDD

● Particle size: Approx. 2 μm
*Please consult us for 1 μm requirements.
● Film thickness: Approx. 2 μm

● B (Boron) doping concentration
1E20 cm-3 or higher
| Size | Minimum Unit | Shipping Format |
|---|---|---|
| 3 inch | 1 unit | Tape-mounted, inserted between plastic corrugated boards |
| 12 inch | 1 unit | Tape-mounted, packed in a wafer shipper |
| 6.4 x 6.4 mm | 20 chips | Case packaging |
*Custom orders other than the above are also available. Please feel free to contact us.
7 x 8 mm Case Packaging
6.4 x 6.4 mm

Tape-mounted, plastic corrugated board packaging
6.4 x 6.4 mm 3 inch BDD on Si
